| Item | Processing | Value |
| base Material | TG | 135 |
| 150 | ||
| 170 | ||
| 200 | ||
| 250 | ||
| CTI | 600 | |
| Ceramics | 4350/5880/TMM10/TC600 | |
| Teflon | Taikang Niko/ Wang Ling | |
| metal Material | Copper/Aluminum | |
| Technology | Layer | 1-32 layers |
| Surface Threatment | HAL(Lead/Lead Free)?Immersion Gold?Gold Plated?IG+OSP?IG+Gold Fingers?Peelable Blue Mask?Carbon Ink | |
| Drilling | Mechanical Drill?Hole Diameter≥0.15mm | |
| Laser Drill?Hole Diameter≥0.1mm | ||
| Min. Half Hole?≥0.5mm | ||
| Min. Key Slot?0.65mm | ||
| Tolerrance ?PTH:+/-0.075mm pressure welding Hole:+/-0.05mm NPTH+/-0.05mm | ||
| Aspect Ratio (thickness/hole diameter) | 16:01 | |
| Trace Width/Spacing | ≥3.5mil | |
| Board Thickness | 0.2mm to 3.2mm | |
| Board Thickness Tolerrance | 0.2mm to 1.0mm?+/-0.1mm; ≥1.0mm:+/-10% | |
| Finish Copper Thickness | Inner/Outer Layer 1 ~3OZ | |
| Solder Mask | Photosensitve Ink | |
| Solder Bridge | Green Oil≥4mil?Moltley ≥6mil | |
| Solder Plug Hole | Via Hole/ink/resin stopper | |
| Board size | Max.:500*1200mm?Min.:5*5mm | |
| Resistance Tolerance | ±5Ω??50Ω??±10%?≥50Ω? | |
| Lamination | Pure FR4?FR4+Ceramics?FR4+Aluminum?FR4+Copper |
SMT Assembly Rigid Double-Layers Fr4 Circuit Board